Скачать или смотреть Wire bonding inspection with CHRomatic Line Sensor CLS 2.0 where cycle times are critical.

Next-generation high-speed quality control in smart factories with 21.6 million points measured per second. The 3D structure of your sample is determined in a very short time through fast line scanning at up to 18300 lines per second – ideal for inline applications where cycle time
is critical.

The chromatic confocal measurement technology from Precitec 3D Metrology provides data with an extremely high lateral and axial resolution, enables measurement of any kind of material, and functions without shadowing effects – even for complex geometries.

It is highly suitable for applications in consumer electronics and semiconductor industries, such as inspecting the topography of smartphone housings or semiconductor chips, as well as measuring and inspecting solder bumps or detecting die cracks. For wire bonding inspection e.g detection of shortcuts between crossing wires, maximal height of wires measured and non-existing connections on PCB or chip indicated.

A long line of up to 12 mm can be selected for fast inspection of
large parts or a shorter line with an outstanding numerical aperture for measuring highly angled surfaces, e.g. the chamfer of smartphone or watch display glasses.

Semiconductors: Wire bonding inspection, bump measurements, packaging wafer edge inspection, dicing groove inspection, defects, die cracks, photomask lithography

Consumer electronics: Housing topography inspection, inspection of slightly, medium and highly curved surfaces, chamfer and spline inspection, diameter/hole/stepped surface inspection, cosmetic inspection with additional height data