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3D MID: Cost of LDS (http://selectconnecttech.com)

Today we have the fourth episode in a series featuring Stephan Schmidt, President of LPKF USA. Stephan and I recently sat down to discuss LDS, where it is utilized today and where it is going in the near future.

I hope you find the conversation as interesting as I did.

Please turn up your volume for the conversation as the microphone was experiencing some technical difficulties.

Today Stephan answers the questions:

What are the costs associated with LDS?

and

What makes LDS a better solution?

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SelectConnect Technologies manufactures 3-dimensional molded interconnects using the LPKF-LDS process to laser scribe circuitry on injection molded components as well as selectively plates circuits integrated into components produced by the Double-Shot molding process.

As the only contract provider of LDS 3D-MID services in North America, we work on projects from early phase prototypes and scale up to high-volume production.