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🌡️ Data Center Cooling Simulation Using ANSYS Icepack | Transient Thermal & CFD Analysis

In this video, we demonstrate a CFD-based thermal simulation of a data center setup using ANSYS Icepack. Data centers house high-density electronic equipment like processors, memory modules (DDR3), and heat sinks, all of which generate significant heat. Without proper cooling, performance and hardware lifespan can be severely affected.

To ensure optimal operating conditions, we simulate heat dissipation and airflow patterns inside a modeled server system. Using SpaceClaim for CAD geometry idealization and ANSYS Icepack for CFD and transient thermal analysis, this study explores temperature distribution and ventilation efficiency under forced convection scenarios.

🎯 Simulation Objectives:

*Predict temperature rise and cooling patterns over time

*Identify hot spots in the data center model

*Optimize component placement and airflow paths

*Validate forced convection cooling design

🛠️ Tools Used:

*SpaceClaim (CAD Modeling)

*ANSYS Icepack (Thermal CFD Analysis)

*ANSYS Transient Thermal Solver

📌 Ideal for:
Thermal engineers, data center designers, CFD professionals, and students in thermal sciences or mechanical engineering.

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