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In this video, Leo Wang explains why the 'Copper Era' of computing is officially over and how a massive breakthrough from Intel and TSMC is about to change everything for AI and hardware. Learn about the shift to Glass Substrates and Co-Packaged Optics (CPO) that will slash energy costs and destroy the 'I/O Wall'.

Key topics covered:
The end of copper wires in high-performance computing.
Why Glass Substrates are the future of AI chips.
How CPO technology is solving the power crisis in data centers.
The rise of the 'Glass Barons' and the new semiconductor supply chain.

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