Arizona and the future of semiconductor innovation: Arizona State University (ASU)

Описание к видео Arizona and the future of semiconductor innovation: Arizona State University (ASU)

America’s most innovative university chips in to advance packaging. ASU has launched a ground-breaking collaboration with Deca Technologies, a Tempe, Arizona-based provider of advanced packaging technology. ASU and Deca will create North America’s first fan-out wafer-level packaging research and development center.

0:00 Introduction
0:14 Moore's Law
1:08 Opportunity knocks
2:33 Our strategy
3:55 The road ahead

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