Скачать или смотреть cyberTECHNOLOGIES’ CT300 SERIES FOR AUTOMATED METROLOGY FOR ADVANCED PACKAGING

cyberTECHNOLOGIES’ CT300 SERIES AUTOMATED METROLOGY FOR
ADVANCED PACKAGING
The cyberTECHNOLOGIES CT300 Series delivers high-speed wafer scanning with precision you can trust. Its advanced sensors rapidly capture full-wafer data and analyze each chiplet individually—pinpointing position, deviation from nominal, tilt, and rotation. Or measure micro-bumps for height, diameter, volume, position or looking for bridging, missing bumps or other defects.
Users can instantly zoom in on any chiplet or bump for detailed inspection, while the system automatically flags excursions for any device that falls outside specifications, ensuring faster decisions and tighter process control. Reach out to us for a system demonstration on your samples so you can see what the cyberTECHNOLOGIES systems can do for you to improve your process control and yield.
HIGH-SPEED WAFER SCANNING WITH PRECISION YOU CAN TRUST