Скачать или смотреть The Angstrom Age: TSMC’s N2 Platform and Agentic AI

TSMC has officially entered the Angstrom era by launching mass production of its 2-nanometer (N2) process, marking a significant architectural shift to Gate-All-Around nanosheet transistors. This transition is specifically designed to meet the massive computational and energy requirements of the AI supercycle, offering substantial improvements in power efficiency despite the challenges of stalled SRAM scaling. To manage technical risks, the company is using a phased roadmap that introduces new transistor structures now while delaying backside power delivery until the subsequent A16 node. Major industry leaders like Apple and Nvidia have already secured the limited initial capacity, prioritizing high performance and thermal management for next-generation devices and data centers. Although wafer prices have surged to $30,000, TSMC’s dominant yield rates and advanced 3D packaging solutions solidify its position as the essential manufacturer for the future of global computing.