T20 AI desoldering glue removal module using

Описание к видео T20 AI desoldering glue removal module using

i2C new launched CPU chip glue removal module for T20 AI desoldering station.
Supports Apple and Android motherboard separation, chip and CPU glue removal and no damage, support 99% of Chip glue removal in the market
Contact with Bellona +8618124069709

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