Скачать или смотреть Samsung's HBM4 Chips Earn Strong Customer Praise: "Samsung is Back"

In a New Year's address on January 2, 2026, Samsung Electronics co-CEO and chip division head Jun Young-hyun revealed that customers have lauded the differentiated competitiveness of its next-generation HBM4 high-bandwidth memory chips, with some explicitly stating "Samsung is back."
The positive feedback signals a potential turnaround for Samsung in the AI memory market, where it has trailed rival SK Hynix in recent HBM generations. The company is in close discussions to supply HBM4 to Nvidia for its upcoming Rubin AI accelerators (slated for late 2026) and reportedly secured deals for Google's next-gen TPUs.
Mass production of HBM4 is set to begin in February 2026 at Samsung's Pyeongtaek campus, with plans to ramp HBM capacity by ~50% amid surging AI demand. Samples have already passed key validations, positioning Samsung to capture share in the exploding HBM market.
Shares jumped over 4% following the announcement, outperforming the broader market.

#Samsung #HBM4 #AICHips #Nvidia #Semiconductors #AIMemory #SKHynix #TechNews #MemoryTech #KoreaTech #alchetron #vibenews #viral

Read more: https://alchetron.com/High-Bandwidth-...