Скачать или смотреть TPT HB100 - Automatic Ball & Wedge Wire Bonder : Gold Bump Bonding

Accelonix Benelux - Distributor of TPT Wire Bonding Solutions for more information about our micro electronics packaging solutions please visit : www.accelonix.nl

The HB100 represents a new generation of full automatic desktop wire bonder with motorised Z-X-Y axis and bondhead rotation and pattern recognition.

-Big advantage : Very user friendly to operate/program. Everyone can bond!
-Perfectly suited for laboratories and small volume productions.
-This versatile machine can perform wedge, ball and bump bonding with a single bond head.
-With fast, precise linear motor axis, the HB100 is very easy to use and packed with exciting features such as a touch-screen, dual camera system and joystick control.
-In addition, the latest software technology supports the user with process guidance and bond assist features.