Скачать или смотреть Chip Packaging Market Analysis 2025-2032

Chip Packaging Market Overview -

Chip packaging refers to the process of enclosing a microchip in a protective casing to enable its safe use and integration into electronic devices within the semiconductor industry. This packaging not only provides mechanical support and electrical connections between the chip and the external world but also helps in heat dissipation, ensuring the chip’s performance and longevity. Various types of packaging are used depending on the application, including ball grid array (BGA), chip-on-board (COB), and flip-chip packaging.

➣ Market Growth -

The global Chip Packaging market was valued at US$ 32050 million in 2022 and is projected to reach US$ 48900 million by 2029, at a CAGR of 6.2% during the forecast period.

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