Скачать или смотреть Teardown of an IBM 9121 Mainframe Thermal Conduction Module (TCM)

A teardown of an Thermal Conduction Module (TCM), made by IBM and used in the ES/9000 series 9121 mainframe processor.
It contains up to 121 chips on a ceramic substrate with spring loaded copper pistons that conduct heat from each individual chip to the module backing plate. A very large air-cooled heatsink then conducts the heat out of the TCM.

Link to photo page of the processor unit:-
http://hampage.hu/oldiron/ibms/es9000...

A PDF describing the TCM system it uses:-
http://citeseerx.ist.psu.edu/viewdoc/...

A cut-away close up view of the module internal construction:-
https://www.flickr.com/photos/jurvets...

Another picture of a TCM:-
https://www.flickr.com/photos/2585601...

My page about IBM packaging technology (TCM is at the end):-
http://members.optusnet.com.au/intare...