Скачать или смотреть Must-read for Engineers! Finding Advanced Packaging Joint Defects in 3 Steps【iST EaseYourPain EP.24】

board level reliability (BLR) test is a common method used across the globe to verify solder joint strength when soldering an IC on the PCB.
When the BLR test fails and you are asked to debug, how will you start?
Don't worry!
This video will show you three simple steps to quickly find the defect locations!

00:00 Introduction
00:20 Today’s Host - Hana
00:36 What are BLR and Daisy Chain
01:25 3 Simple Steps
01:32 Finding Detects in Ordinary Packaging
01:45 Ordinary Packaging: Steps for Analyzing Leakage/Short
02:10 Ordinary Packaging: Steps for Analyzing for an Open Circuit
02:33 Bisection Method
03:55 Introduction of The Expert of Failure Analysi-David
04:06 Finding Detects in Advanced Packaging
04:14 Advanced Packaging: Steps for Analyzing Leakage/Short
04:36 Advanced Packaging: Steps for Analyzing OPEN
06:02 Ending
06:21 Gag Reel

📍【iST Tech Classroom Article】：
Finding advanced packaging joint defects after failing the board level reliability test
https://pse.is/220628YTenweb

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