Скачать или смотреть Zhuomao ZM r6200 BGA rework station/ BGA chip repair machine Semi Automatic how to hot air reballing

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Product Application
1.Desolder and solder all the BGA Chip, remove and repair different motherboard BGA IC chip and other components (Lead free & lead available).
2.2. It can cut down the production cost from reworking the bad soldering IC Chip during the PCB assembly procedure. 3.
3.With Optical alignment system, you can rework the BGA well easily, and protect your weak eyes.
4.It can rework the BGA, LED, IC and other micro chipsets in high precision. Especially suit for high precision motherboard rework, it is designed for precise rework.
5.Widely used for BGA reballing chipset repairing in laptop, PS3,PS4,XBOX360, Mobile phone, etc.
6.Rework micro BGA, VGA, CCGA, QFN, CSP, LGA, SMD, etc
Main features                                                   
Large area of infrared carbon fiber Pre-heating system, with the advantage of pre-heating fast and evenly and no light pollution.
Temperature parameters protected by limits of authority, for avoiding error settings.
Ten segments of temperature control process, suitable for all kinds of BGA Rework.
Unlimited storage of the temperature profile, just need press one key to use the profile.
Three K-type sensors available can realize the high precise temperature testing of each point of PCB or BGA, and PC can generate report of curves analysis automatically.
Desoldering and soldering automatically, No need the manual adjustment
Hot air flow can be adjustable to meet the demand of any chips
USB Connection driver-free, PC control
The bottom hot air lifting control available in the front panel, it is convenient to adjust at any time.
Laser positioning available, to make the positioning faster.