Скачать или смотреть Acoustic Propagation of Solder Bump Edge 55 micrometer

This video is an appendix entry for the PhD Thesis titled: Numerical Study for Acoustic Micro Imaging of Three Dimensional Microelectronic Packages, by Chean Lee.

This video is part of a 4 part series that shows the acoustic mechanism as the transducer scanning is positioned closer to the edge between the solder bump and the silicon die. This video compares the acoustic propagation mechanism in the flip chip - solder bump construction with and without a crack type defect. The simulation was carried out using ANSYS APDL and Matlab for post processing work.
The images splits the acoustic wave into their individual X, Y and Vector Sum components. The top row features a nominal solder bump attached to a flip chip via a UBM. The bottom row is modelled with a crack defect.