DesignCon 2021: Making chips for Samsung

Описание к видео DesignCon 2021: Making chips for Samsung

Earlier this month, DesignCon 2021 began as of the first technology conferences of 2021, bringing together the chip, board, and systems design engineers for three days of knowledge sharing and professional education.

In this interview, Chuck Martin, editorial director at Informa Tech, talks chip design with Max (Sunghwan) Min, package and SI/PI architect at Samsung Electronics America.

They discuss the role of memory chips in modern devices, the uptake of 5G, and the impact of AI on the silicon design landscape.

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