Dam and fill protection of PCB components: Momentive SnapSil TN8000 & TSE3064H Adhesives

For demanding applications that require complete component protection, Momentive’s advanced silicone materials work together to create low stress dams and flexible, low viscosity fills to help ensure complete encapsulation and reliable operation in high stress environments.

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Learn more about Momentive's wide portfolio of Silicone solutions below:

Silicones for Automotive Applications: https://www.momentive.com/industries/...

Thermal Management for Automotive Electronics: https://www.momentive.com/categories/...

Optical Bonding Silicones: https://www.momentive.com/categories/...

Thermally conductive gap fillers: https://www.momentive.com/en-us/categ...

Conformal coatings for electronics: https://www.momentive.com/en-us/categ...

This video was demonstrated on automated PVA dispensing equipment.