Скачать или смотреть Breaking down 50 million pins: A smarter way to design 3D IC packages – Podcast Ep. 16

How do you design and verify a package with tens of millions of pins without losing months to manual rework?

In this episode of the Siemens 3D IC Podcast, host John McMillan speaks with Per Viklund, Director of IC Packaging and RF Product Lines at Siemens EDA, about the growing challenge of managing chiplet and interposer complexity in advanced 3D IC designs.

Per explains how hierarchical device planning enables designers to work at the right level of abstraction, streamlining the creation, optimization, and verification of massive, high-pin-count packages.

The discussion covers why spreadsheet-based methods no longer cut it, the risks of unsynchronized workflows, and how early, multi-domain analysis can prevent costly late-stage redesigns.

The episode also introduces Siemens' Innovator 3D IC, a unified, AI-infused solution designed to support the entire packaging workflow, from early planning through final layout. It features built-in data management to eliminate version errors.

Whether you're an IC packaging engineer, 3D IC architect, chiplet designer, substrate fabricator, or verification professional working on high-complexity designs, this episode is for you!

What you'll learn in this episode:
• Current changes in IC Packaging and the impact on the whole ecosystem (01:50)
• How to manage complexity scaling (03:00)
• What hierarchical device planning is and why it matters (03:35)
• How traditional methods fall short for high-pin-count designs (05:00)
• The risks and consequences of package assembly errors (06:20)
• What next-gen tools must deliver for designers (07:00)
• Siemens’ Innovator 3D IC Portfolio overview (09:10)

Connect with Per Viklund LinkedIn: https://sie.ag/4YrrAF
Connect with John McMillan LinkedIn: https://sie.ag/ik9ns

About Siemens 3D IC Design Flow: a comprehensive set of tools and workflows targeted to develop advanced 2.5 and 3D IC heterogeneous system-in-package (SIP) designs.

Explore more about Siemens EDA's marketing-leading 3D IC technology solution: https://sie.ag/3mzu8y

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