Скачать или смотреть Sinerji/ Heller 1809 Mark III Series - SMT Reflow Oven

Best value SMT Reflow Ovens in the market. Designed for Low Cost of Ownership.

Lead Free Certified
Enhanced Heater Modules
New Flux Management System - Eliminates Maintenance
Intuitive Control System
Programmable Cooling
Integrated CPK Software
The best technology and the best value for money reflow ovens
The breakthroughs associated with the Mark III reflow system provide you with an even lower cost-of-ownership. Heller's heating and cooling advances deliver up to 40% reduction in nitrogen and electrical consumption. This makes the MK III system not only the premier reflow soldering system but the best overall value in the industry!

1809 Mark III
1809 Mark III (with optional 3rd cooling zone)
The 1800 models support high mix / high volume throughput... at speeds up to 32 inches (80 centimeters) per minute, while conserving valuable factory floor space. Rapid response times and precise temperature controls assure process uniformity, regardless of component density or board loading, with identical profile performance in either air or nitrogen.

Highest Yields and Tight Process Control

The most efficient heat transfer from extra high volume, high-velocity, heating modules, producing heater module response of less than one second to temperature changes of less than 0.1ºC, thereby maintaining profile integrity for heavy board loads.
Wide process window for "universal profiling" - allows many different boards to be run on a single temperature profile
Advanced 5 thermocouple PCB profiling and process parameter logging capability with the capacity to store up to 500 temperature recipes and 500 profile graphs
With a high-capacity, 26-inch wide heater module, the 1800 Mark III series reflow oven offers unmatched flexibility in board handling. The oven may be fitted with an adjustable single-rail edge hold conveyor/mesh belt combo, to carry even the largest boards or multi-board panels (up to 20 inches wide) through the oven.