Скачать или смотреть wafer marking laser automation www.wlsc.com laser system integration laser automation

Worldwide Laser Service Corporation www.wlsc.com 480.892.8566 option 4 or e-mail [email protected] demonstrates laser system automation for laser wafer marking, the system shown in this video is for manual loading and unloading of silicon wafers by an operator using a vacuum wand, the wafers are loaded onto a vacuum chuck which can accommodate 100mm and 150mm wafers – system design can be changed to accommodate larger wafers even up to 300mm] The vacuum chuck holding the wafers has a toggle switch and 3 way valve allowing the operator to turn vacuum on and off for easy loading and unloading, this system is equipped with a UV 355nm laser and galvo head with 330mm focus lens to provide complete coverage of the 150mm wafer by the laser beam, the laser beam optics include a movable/changeable expansion mirror which allows the laser beam to be adjusted from 20µm to 50µm with an approximate 10 minute manual change over process, the system also has a beam polarizer in the optics path equipped with a scaled dial allowing the laser power to be dialed down to 300miliwatts which maintaining peak laser KHz, rep rate, and other critical beam characters. The manual laser marking system is designed for prototype and/or lower production run applications and also designed for quick and easy retro-fit with load, unload, and rejection cassettes, vision camera, robot for wafer handling and pre-aligner for precise wafer placement and laser marking/scribing.
The laser system engineers at WLSC are expert at laser system automation and laser integration, let us design, build and install the correct laser system for your company needs, at Worldwide Laser we KNOW lasers! www.wlsc.com