Скачать или смотреть Malaysia Targets To attract RM500billion

In the initial phase, domestic direct investment (DDI) focuses on integrated circuit (IC) design, advanced packaging, and manufacturing equipment. Foreign direct investment (FDI) is aimed at wafer fabrication and manufacturing equipment.

During the second phase, Malaysia aims to develop at least 10 local companies in advanced design and packaging, with acquisitions ranging from RM1 billion to RM4.7 billion (US$210 million to US$1 billion). The country also aims to mentor around 100 semiconductor-related companies with nearly RM1 billion (US$210 million) in revenue, creating higher-paying jobs for Malaysian workers.

The final phase targets doubling down by supporting the development of world-class Malaysian semiconductor design, advanced packaging, and manufacturing equipment firms, while attracting major chip buyers like Apple, Huawei, Lenovo, and other leading tech companies to advance manufacturing in Malaysia.

To achieve these goals, Malaysia will develop a global research and development hub for semiconductors, involving top-tier universities, corporations, and centers of excellence. Additionally, 60,000 highly skilled Malaysian engineers will be trained to meet the increasing demand from the sector.

The government will allocate at least RM25 billion in fiscal support for the National Semiconductor Strategy (NSS) with targeted incentives, to be detailed soon by the Ministry of Investment, Trade, and Industry.

Anwar emphasized Malaysia's neutrality as the ideal semiconductor production location, aiming to build a more secure and resilient global semiconductor supply chain.

To strengthen Malaysia's commitment to becoming a global leader in the semiconductor industry, a Special Task Force for the NSS (NSSTF) will be established, with Collaborative Research in Engineering, Science, and Technology (CREST), an agency under MITI, serving as the secretariat.