Solidworks simulation 147| Steady state thermal analysis of heat sink

Learn to conduct steady state thermal analysis using soldiworks thermal simulation module.
Heat sinks are commonly used to enhance heat dissipation from
electronic devices. In the case study, we conduct thermal analysis of a heat sink made
of aluminum with thermal conductivity k = 170 W/(m K), density ρ = 280 0 kg/m3, spe-cific heat c = 870 J/(kg K), Young’s modulus E = 70 GPa, Poisson’s ratio ν = 0.3, and ther-mal expansion coefficient α = 22 × 10−6/°C. A fan forces air over all surfaces of the heat
sink except for the base, where a heat flux q′ is prescribed. The surrounding air is 28°C
with a heat transfer coefficient of h = 30 W/(m2°C). (Part A): Study the steady-state ther-mal response of the heat sink with an initial temperature of 28°C and a constant heat
flux input of q′ = 1000 W/m2.

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***Subscribe***Subscribe***Subscribe***Subscribe***Subscribe***Learn to conduct steady state thermal analysis using soldiworks thermal simulation module.
Heat sinks are commonly used to enhance heat dissipation from
electronic devices. In the case study, we conduct thermal analysis of a heat sink made
of aluminum with thermal conductivity k = 170 W/(m K), density ρ = 280 0 kg/m3, specific heat c = 870 J/(kg K), Young’s modulus E = 70 GPa, Poisson’s ratio ν = 0.3, and thermal expansion coefficient α = 22 × 10−6/°C. A fan forces air over all surfaces of the heat
sink except for the base, where a heat flux q′ is prescribed. The surrounding air is 28°C
with a heat transfer coefficient of h = 30 W/(m2°C). (Part A): Study the steady-state thermal response of the heat sink with an initial temperature of 28°C and a constant heat
flux input of q′ = 1000 W/m2.

For more solidworks simulation tutorials, please subscribe
   / ansol  


For more tutorials on solidworks, please
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