OCP Global Summit - All Keynotes

Welcome to the 2023 OCP Global Summit
By George Tchaparian, CEO - OCP
By Cliff Grossner, Ph. D., Chief Innovation Officer - OCP
By Zaid Kahn, VP, Cloud AI & Advanced Systems Engineering - Microsoft
From Edge to Cloud: System Design in the Era of AI - presented by Intel
By Zane Ball | Corporate Vice President - General Manager - Data Center Platform Engineering & Architecture - Intel Corporation
Unleashing the Power of Collaboration: Overcoming Memory Challenges in the AI/ML Era - presented by Samsung
By JongGyu Park, CVP - Samsung
By Vincent Kim, Head of DSRA-AVP - Samsung
AI Drives Need for (more) Speed - presented by Marvell
By Loi Nguyen, EVP, Optical - Marvell
Together We Advance the Modern Data Center - presented by AMD
By Forrest Norrod, Executive Vice President and General Manager, Data Center Solutions Business Group - AMD
Ethernet - The Path to Singularity - presented by Broadcom
By Ram Velaga, SVP & GM, Core Switching Group - Broadcom
Igniting Change for the Future of Data Center Cooling
By Rolf Brink, CEO - Promersion
Sustainable Secure Societal Infrastructure for the AI-driven Future - presented by Google
By Partha Ranganathan, VP and Engineering Fellow - Google
The Changing Landscape of AI in the Data Center - presented by Microsoft
By Reynold D'Sa, CVP, Silicon, Cloud Hardware, and Infrastructure Engineering - Microsof
Open Infrastructure Platforms to usher in age of GenAI - presented by Meta
By Dan Rabinovitsj, VP, Data Center Infrastructure - Meta
Closing Remarks
By Kali Burdette, Director of Global Events - OCP