Скачать или смотреть Advanced Part Average Testing For Chips

Part average testing, one of the mainstays of semiconductor test, is becoming much more challenging at advanced nodes and in multi-die assemblies. In the past, PAT produced a Gaussian distribution that made it relatively simple to find outliers. That's no longer the case. Advanced packaging and leading-edge designs have unique attributes that determine which rules apply, such as the thickness of the wafer or unique zonal issues. Aftkhar Aslam, co-founder and CEO of yieldWerx, talks with Semiconductor Engineering about what causes low yield in these chips, why multi-modal approaches are needed to ensure good yield, and why neighboring dies can make the testing process significantly more complicated.