Advances in Interconnect & Assembly Technologies for Next Generation Electronic Systems

Описание к видео Advances in Interconnect & Assembly Technologies for Next Generation Electronic Systems

iNEMI Packaging Tech Topic Series
December 13, 2022
Speaker: Chris Scanlan, Senior Vice President Technology, Besi Switzerland AG.

Computing growth is being driven by big data and AI, and this high-performance computing is driving rapid innovation in chiplet assembly technologies. Chiplet architectures and advanced SiP devices require integration of multiple chips with advanced, fine pitch interfaces. This presentation discussed chip-to-wafer hybrid bonding as a new interconnection technology that provides extremely high interconnect density. Other advanced interconnect methods were also discussed, along with some of the challenges and equipment solutions to enable next generation electronic systems.

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