Paul Franzon

System Verilog forDesign
System Verilog forDesign
How to succeed doing a PhD in Electrical and Computer Engineering
How to succeed doing a PhD in Electrical and Computer Engineering
Implementation of a Chaotic Neural Network Reservoir on a TSV Stacked 3D CyclicNeural Network IC
Implementation of a Chaotic Neural Network Reservoir on a TSV Stacked 3D CyclicNeural Network IC
Design for a 3D Stacked Neural Network Circuit with Cyclic Analog Computing, Koji Kiyoyama
Design for a 3D Stacked Neural Network Circuit with Cyclic Analog Computing, Koji Kiyoyama
Cu-to-Cu Direct Bonding Through Highly Oriented Enlarged Cu Grains for Advanced 3D-LSI Applications
Cu-to-Cu Direct Bonding Through Highly Oriented Enlarged Cu Grains for Advanced 3D-LSI Applications
Proposed Standardization of Chiplet Models for Heterogeneous Integration, Anthony Mastroianni
Proposed Standardization of Chiplet Models for Heterogeneous Integration, Anthony Mastroianni
Thermal Reliability Considerations of Resistive Synaptic Devices for 3D Compute InMemory System Perf
Thermal Reliability Considerations of Resistive Synaptic Devices for 3D Compute InMemory System Perf
Electrical and Performance Advantages of Advanced Monolithic Cooling for 2.5DHeterogeneous ICs
Electrical and Performance Advantages of Advanced Monolithic Cooling for 2.5DHeterogeneous ICs
Multi-ANN Embedded system based on a custom 3D-DRAM, Paul Franzon NCSU
Multi-ANN Embedded system based on a custom 3D-DRAM, Paul Franzon NCSU
3D DRAM Accelerators Review, Prasanth Ravichandiaran, NCSU
3D DRAM Accelerators Review, Prasanth Ravichandiaran, NCSU
Heterogeneous integration: The devil is in the details, invited talk, Alan Huffman, Micross
Heterogeneous integration: The devil is in the details, invited talk, Alan Huffman, Micross
Miniature heterogeneous microLED packages for high performance display systems, Chris Bower Xdisplay
Miniature heterogeneous microLED packages for high performance display systems, Chris Bower Xdisplay
Packaging challenges in 100-300 GHz wireless, invited talk, Mark Rodwell, UCSB
Packaging challenges in 100-300 GHz wireless, invited talk, Mark Rodwell, UCSB
3D IC advanced technologies for smart imager, invited talk, Pascal Vivet, CEA-LIST
3D IC advanced technologies for smart imager, invited talk, Pascal Vivet, CEA-LIST
Hybrid Bonding Technology Enabliing High Performance Computing, Gill Fountain, Xperi
Hybrid Bonding Technology Enabliing High Performance Computing, Gill Fountain, Xperi
3D Integration -- trends, challenges and opportunities, Madhavan Swaminathan, GeorgiaTech
3D Integration -- trends, challenges and opportunities, Madhavan Swaminathan, GeorgiaTech
2.5D and 3DIC Technology and Design, Tutorial, Paul Franzon, NC State University
2.5D and 3DIC Technology and Design, Tutorial, Paul Franzon, NC State University
Advanced Packaging Enablement for Compute, Keynote, Robert Patti, NHanced Semiconductor
Advanced Packaging Enablement for Compute, Keynote, Robert Patti, NHanced Semiconductor
3DIC challenges panel, organized and moderated by Jan Vardaman of Techsearch
3DIC challenges panel, organized and moderated by Jan Vardaman of Techsearch
3D for More Moore, Plenary, Mustafa Badaroglu, Qualcomm
3D for More Moore, Plenary, Mustafa Badaroglu, Qualcomm
Future Challenges for on package interconnects, Plenary, Debendra Das Sharma, Intel
Future Challenges for on package interconnects, Plenary, Debendra Das Sharma, Intel
Introduction2v2
Introduction2v2
Introduction1v2
Introduction1v2
Revision
Revision
Reset
Reset
Do a PhD in ECE at NC State University
Do a PhD in ECE at NC State University
Digital Logic Basics Review - 3. Computer Arithmetic
Digital Logic Basics Review - 3. Computer Arithmetic
Digital Logic Basics Review - Sequential Logic
Digital Logic Basics Review - Sequential Logic
Digital Logic Basics Review 1. Combinational Logic
Digital Logic Basics Review 1. Combinational Logic
Doing an MS degree in Electrical and Computer Engineering at NC State University
Doing an MS degree in Electrical and Computer Engineering at NC State University