[Eng Sub] Wafer Level Chip Scale Package (WLCSP)

Описание к видео [Eng Sub] Wafer Level Chip Scale Package (WLCSP)

1. WLCSP
: Die, Repassivation, Bump
: Repassivation(PI, PBO - HD MicroSystems)
: Batch Process
2. Structure
: Bump on Bond Pad
: Bump on RDL
: Backside Coating - Backside Lamination Tape
: Side protection - 6, 5, 4-side
3. Process
: Bump on RDL
4. Application
: Power management IC , Audio codec

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