Co-EMIB, Intel’s EMIB and Foveros Tech Together, Delivers High Bandwidth at Low Power

▶ Learn more about Intel's Process and Packaging Innovations: https://intel.ly/3GonMP1

Intel’s #EMIB and #Foveros technologies leverage high-density interconnects to enable high bandwidth at low power, with I/O density on par with or better than competitive approaches. The company’s new Co-EMIB technology enables the linkage of even more computing performance and capability together. Co-EMIB allows for the interconnection of two or more Foveros elements with essentially the performance of a single #chip. And designers can also connect analog, memory and other tiles with very high bandwidth and at very low power.
#Intel #Technology

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