Understanding Thermal Gap Filler Pads, PCB Deflection, and Stress

Описание к видео Understanding Thermal Gap Filler Pads, PCB Deflection, and Stress

Managing compression force and stress is critical in any application that incorporates gap filler pads as a thermal interface. In this webinar, we will look at the compression characteristics of thermal gap filler pads. We will apply this understanding to a PCB assembly. Webinar attendees will have a better understanding of the basic analytical techniques and tests that can be performed to understand stress as well as defection in both gap filler pads and PCB.

Presented by Christian Miraglia, Applications Engineering Manager

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