How to Select a Thermal Gel or Thermal Gap Pad | Parker Chomerics

Design engineers, mechanical engineers -- this webinar is designed to help you decide which thermal interface material type is right for your application: thermally conductive dispensable gels of gap filler pads. Hosted by Callie King, thermal product manager and Ben Nudelman, market sales engineer, both of Parker Chomerics, this webinar will focus on:
• How to determine which thermal interface material is right for you
• The benefits of each - a dispensable gel or gap pad
• Determining your requirements and selecting a material that best suits your application
• Q&A at the end – over 30 audience questions answered!

The objective of thermal management programs in electronic packaging is the efficient removal of heat from the semiconductor junction to the ambient environment.

Heat generated by a semiconductor must be removed to the ambient environment to maintain the junction temperature of the component within safe operating limits. Often this heat removal process involves conduction from a package surface to a heat spreader that can more efficiently transfer the heat to the ambient environment. The spreader has to be carefully joined to the package to minimize the thermal resistance of this newly formed thermal joint.

Attaching a heat spreader to a semiconductor package surface requires that two commercial grade surfaces be brought into intimate contact. These surfaces are usually characterized by a microscopic surface roughness superimposed on a macroscopic non-planarity that can give the surfaces a concave, convex or twisted shape. When two such surfaces are joined, contact occurs only at the high points. The low points form air-filled voids. Typical contact area can consist of more than 90 percent air voids, which represents a significant resistance to heat flow.

Thermally conductive materials are used to eliminate these interstitial air gaps from the interface by conforming to the rough and uneven mating surfaces. Because the TIM has a greater thermal conductivity than the air it replaces, the resistance across the joint decreases, and the component junction temperature will be reduced. A variety of material types have been developed in response to the changing needs of the electronic packaging market.

Thermal Interface Material Catalog: https://www.parker.com/parkerimages/P...
Thermal Interface Material Dispensing Guide: http://www.parker.com/Literature/Chom...

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Parker Hannifin is a Fortune 250 global leader in motion and control technologies. For more than a century, the company has been enabling engineering breakthroughs that lead to a better tomorrow.

The company's products are vital to virtually everything that moves or requires control, including the manufacture and processing of raw materials, durable goods, infrastructure development and all forms of transport. Key technology areas are aerospace, climate control, electromechanical, filtration, fluid and gas handling, hydraulics, pneumatics, process control, sealing and shielding and human motion. Traded on the New York Stock Exchange under the symbol "PH,"​ Parker is strategically diversified, value-driven and well-positioned for global growth as the industry consolidator and supplier of choice.
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