UCIe Package Modules : Standard vs Advanced vs 3D : Part 2

This video is about the differences between standard, advanced, and 3D package modules. It discusses the different generations of interconnection bump technology, including C4, C2, and 3D IC. The video also details the different characteristics of each package module, such as channel reach, number of lanes, and bandwidth. Finally, the video provides information on the transmitter and receiver pad capacitances required to achieve the desired speed per lane.

Here are some key points from the video:

The first generation of interconnection bump technology used lead shoulder bumps with a pitch exceeding 130 microns.
The second generation of interconnection bump technology used microbumps with a pitch ranging from 40 to 130 microns.
The third generation of interconnection bump technology used copper pillars with a pitch below 130 microns.
Standard package modules use C4 bumps and have a channel reach of up to 25 mm and a bandwidth of up to 512 Gbps.
Advanced package modules use microbumps and have a channel reach of up to 2 mm and a bandwidth of up to 2 Tbps.
3D package modules use copper pillars and have a channel reach that is fixed and a bandwidth of up to 320 Gbps.
The transmitter and receiver pad capacitances are important for achieving the desired speed per lane.
The video provides a table of the maximum effective capacitance allowed for each package module and speed.
Overall, the video provides a comprehensive overview of the different package modules available and the key factors to consider when choosing a package module for a particular application.

Here are some additional details from the video:

The video includes several diagrams and images to help illustrate the different concepts.
The video is presented in a clear and concise manner.
The video is informative and educational.