Dispensable Ultra-High Thermal Conductivity Gap Fillers

Описание к видео Dispensable Ultra-High Thermal Conductivity Gap Fillers

Introducing MOMENTIVE'S SILCOOL™ ultra-high thermally conductive dispensable gap fillers:

10.1 W/m.K 2-component gap filler
Electrically Insulative
Dispensable
Non-Sagging

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This 2-component gap filler cures with heat or at room temperature to become a soft, stress-absorbing TIM. And, since it is liquid dispensed, it can conform to PCB component shapes without causing stress.

Learn more about Momentive's ultra-high thermal gap fillers: https://www.momentive.com/categories/...

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