Packaing Part 4 - 2.5D and 3D

References:
[1] Company, E. (2019, April 19). 2.5D and 3d ICs: New paradigms in ASIC. Retrieved March 01, 2021, from   / 2-5d-and-3d-ics-new-paradigms-in-asic  
[2] David. (2020, October 30). Global interposer MARKET 2020 Industry key player – Murata, ALLVIA, Inc, tezzaron, AGC Electronics, Tsmc, XILINX, Amkor, umc, IMT, Plan Optik AG,. Retrieved from https://bcfocus.com/global-interposer...
[3] Fangaria, P. (2019, June 14). 3D-Ic physical design. Retrieved from https://semiwiki.com/fpga/xilinx/1039...
[4] McLellan, P. (2019, June 14). 2.5D and 3d designs. Retrieved March 02, 2021, from https://semiwiki.com/eda/ansys-inc/75...
[5] Tanmay. (2021, January 29). 2.5D IC flip Chip product Market Insights, technology advancements and FORECAST 2021TO 2026. Retrieved from https://www.mccourier.com/2-5d-ic-fli...
[6] Peic, A. (2014, August 19). Lithography process innovations For 2.5/3D Part 1: ALLEVIATING TSV Stress. Retrieved from https://www.3dincites.com/2014/08/lit...
[7] Jaschinski. (2012, July 16). Through-silicon-vias. Retrieved from https://www.all-electronics.de/throug...
[8] Staff, S. (2011, December 05). IBM to produce MICRON'S hybrid MEMORY cube In debut of first commercial, 3D chip-making capability. Retrieved from https://phys.org/news/2011-12-ibm-mic...
[9] Sebastian Anthony on March 7, 2. (2012, March 07). The future of computers: 3d chip stacking. Retrieved March 02, 2021, from https://www.extremetech.com/computing...
[10] Castellano, R. (n.d.). Advanced semiconductor packaging starting to change memory market landscape. Retrieved March 02, 2021, from https://seekingalpha.com/article/4082...