HC33-T2.1: Advanced Packaging, Part 1

Tutorial 2, Part 1, Hot Chips 33 (2021), Sunday, August 22, 2021.

Organizer: Ralph Wittig, Xilinx

This tutorial discusses advanced 3D packaging technologies that enable performance and density improvements. Descriptions of the technologies and how they are used in cutting edge applications will be made by industry leaders in packaging and chip design.

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In Part 1, the "technology provider" segment, Intel and TSMC describe their multi-chip packaging technologies in detail.

Technology Provider: Intel packaging technologies for chiplets and 3D
Ravi Mahajan & Sandeep Sane, Intel

Technology Provider: TSMC packaging technologies for chiplets and 3D
Doug Yu, TSMC