Silicon Direct Wafer Bonding for Nanoscale Cavities Fabrication | Protocol Preview

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Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding - a 2 minute Preview of the Experimental Protocol

Stephen R. D. Thomson, Justin K. Perron, Mark O. Kimball, Sarabjit Mehta, Francis M. Gasparini
The State University of New York at Buffalo, Department of Physics; University of Maryland, Joint Quantum Institute; The National Institute of Standards and Technology,; NASA Goddard Space Flight Center, Cryogenics and Fluids Branch; HRL Laboratories,;

A method for permanently bonding two silicon wafers so as to realize a uniform enclosure is described. This includes wafer preparation, cleaning, RT bonding, and annealing processes. The resulting bonded wafers (cells) have uniformity of enclosure ~1%1,2. The resulting geometry allows for measurements of confined liquids and gasses.

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