How To Reball iPhone 14 Pro Max Sandwich - 2 Layer Motherboard. Can I Fix It? No Service No Signal.

Did you know, the iPhone 14 Pro Max is a 2 layer motherboard sandwich. So when these 2 layers separate, it can cause several issues, like No Service, always Searching and No Signal.

In my last video, I showed how to separate the 2 layers using a heat plate. Watch here:    • Can I Add a Sim Slot to the iPhone 14...  
So now it's time to solder it all back together.

Also, I added a SIM Slot. So let's see if we can get the SIM Slot working!

Let me know your thoughts below!

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Timeline:
0:00 Intro
0:38 Testing iPhone 14 Pro Max, top board only
1:14 Visual inspection of the top board under the microscope
2:22 Adding solder to the top layer interposer pads
11:32 cleaning the flux off the board
11:46 Adding solder to the bottom layer interposer pads
21:34 Talking about the SIM Slot & the eSIM circuitry.
24:32 Comparing iPhone 13 Pro Max logic board to the 14 Pro Max
27:11 Reviewing the SIM Slot & eSIM connections on ZXW Boardview Software
34:52 Sandwiching the 2 layers together
44:38 Reviewing the sandwich from the sides & using hot air to close the gap
48:37 Testing the board after the reball
49:40 Reviewing the board under the Seek Thermal Camera
50:15 Splitting the sandwich again & inspecting the board
53:22 Found the problem
54:51 Hand Reballing the sandwich again
1:13:15 Testing the logic board again with DT880
1:13:45 Testing the board in the housing
1:14:45 Reviewing the Cellular Settings to see if SIM slot works
1:16:10 Outro